CPU Architecture:
Helio X23 features clock speeds of (2.3GHz A72 x 2 + 1.85GHz A53 x 4 + 1.4GHz A53 x 4) and coupled with ARM Mali-T880 MP4 780MHz GPU. On the other hand, Helio X27 operates comes with (2.6GHz A72 x 2 + 2GHz A53 x 4 + 1.6GHz A53 x 4) speeds and houses ARM Mali-T880 MP4 875MHz GPU. A-72: Powerful cores for itensive tasks 2GHz A-53: Medium performance cores. 1.6GHz A-53: Low performance cores but highly power efficient.
Specifications:
Both the processors are manufactured by 20nm FinFet process. They also come with advanced CorePilot 3.0 technology, scheduling algorithm for Tri-Cluster architecture. This enables optimized power utilization by intelligently switching cores according to the work load.
Both the SoC’s are capable of handling WQXGA 2560 x 1600 pixels resolution at 60 fps and 1920 x 1080 pixels at 120 fps with 12HZ Blending layers. In terms of hardware components related to network reception, both the Processors come with LTE Modem delivering Cat6 speeds of 300/50 Mbps. They have Integrated Wi-Fi 802.11ac with throughput of up to 280Mbps, supports GPS/GLONASS/Beidou, BT/FM etc.
Availability
If rumors are to be believed, LeEco is already building a phone, LeEco Dual 3, powered by Helio X27. Apparently, we will be able to spot phones with these processors in the first quarter of 2017.
